Semiconductor Wafer Edge Profiling Tool Holder from Japan
Specialized tool holder for edge grinding machines that create chip-resistant profiles on semiconductor wafers. Falls under HTS 8466.93.98.85 as an accessory for heading 8461 wafer processing equipment. Accommodates diamond wheels for sub-10 micron edge geometry.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include edge geometry specification drawings; document wheel runout tolerances; provide spindle speed range compatibility