Semiconductor Wafer Edge Profiling Tool Holder from Japan
Specialized tool holder for edge grinding machines that create chip-resistant profiles on semiconductor wafers. Falls under HTS 8466.93.98.85 as an accessory for heading 8461 wafer processing equipment. Accommodates diamond wheels for sub-10 micron edge geometry.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include edge geometry specification drawings; document wheel runout tolerances; provide spindle speed range compatibility