Semiconductor Wafer Edge Profiling Tool Holder

Specialized tool holder for edge grinding machines that create chip-resistant profiles on semiconductor wafers. Falls under HTS 8466.93.98.85 as an accessory for heading 8461 wafer processing equipment. Accommodates diamond wheels for sub-10 micron edge geometry.

Import Duty Rates by Country of Origin

Origin CountryMFN RateCh.99 SurchargesTotal Effective Rate
🇨🇳China4.7%+35.0%39.7%
🇲🇽Mexico4.7%+10.0%14.7%
🇨🇦Canada4.7%+10.0%14.7%
🇩🇪Germany4.7%+10.0%14.7%
🇯🇵Japan4.7%+10.0%14.7%

Alternative Classifications

This product could be classified differently depending on its characteristics or intended use.

8207.90.30Higher: 40% vs 39.7%

If imported as interchangeable diamond grinding tool without holder

Interchangeable tools classify under Chapter 82 rather than machine parts.

8466.30Lower: 18% vs 39.7%

If for dividing heads used in general metalworking applications

General purpose dividing heads and attachments have separate provisions.

Not sure which classification is right?

Our AI classifier can analyze your specific product and recommend the correct HTS code with confidence.

Import Tips & Compliance

Include edge geometry specification drawings; document wheel runout tolerances; provide spindle speed range compatibility

Related Products under HTS 8466.93.98.85

Czochralski Crystal Puller Control Module

Electronic control module specifically designed for regulating temperature and rotation in Czochralski crystal pullers used to grow monocrystalline silicon boules for semiconductor wafers. This part falls under HTS 8466.93.98.85 as a specialized accessory for semiconductor manufacturing machines in heading 8461. It ensures precise control over crystal growth parameters critical for semiconductor production.

Semiconductor Wafer Slicing Saw Spindle Assembly

Precision spindle assembly for inner diameter wafer slicing saws used to cut ultra-thin silicon wafers from monocrystalline boules in semiconductor fabrication. Classified under HTS 8466.93.98.85 as a key component for machines of heading 8461 dedicated to semiconductor wafer preparation. Features diamond-impregnated blade mounting for sub-micron accuracy.

Float Zone Crystal Grinder Chuck

Vacuum chuck assembly for float zone crystal grinders that shape semiconductor boules to precise wafer diameters while maintaining flat orientation indicators. This accessory for heading 8461 machines is classified in HTS 8466.93.98.85 due to its specialized use in semiconductor material processing. Ensures conductivity type markings remain accurate during grinding.

Wafer Lapping Machine Work Holder

Specialized work holder for double-sided lapping machines that simultaneously lap both surfaces of semiconductor wafers to achieve nanometer flatness. Falls under HTS 8466.93.98.85 as an accessory for semiconductor wafer preparation equipment of heading 8461. Features pin-plate carrier system for uniform pressure distribution.

Silicon Boule Grinder Flattening Fixture

Precision fixture for grinding flats on silicon boules to indicate crystal orientation and resistivity type for subsequent wafer slicing. Classified under HTS 8466.93.98.85 as a special attachment for semiconductor crystal processing machines of heading 8461. Ensures repeatable flat positioning critical for wafer fabrication.

Diamond Wafer Polishing Head Assembly

Carrier head assembly with diamond pad retention system for chemical mechanical polishing (CMP) of semiconductor wafers. This part for heading 8461 polishing machines is classified in HTS 8466.93.98.85 due to its semiconductor-specific design tolerances. Maintains uniform pressure across 300mm wafers during planarization.