Wafer Slicing Diamond Saw Blade from China
Precision diamond-impregnated saw blade designed for wafer slicing saws used to cut monocrystalline semiconductor boules into thin wafers. Specifically engineered for machine tools in subheading 8456.12, suitable solely for printed circuit and semiconductor manufacturing equipment. Its ultra-fine grit and tension control ensure damage-free wafer separation critical for subsequent fabrication processes.
Duty Rate — China → United States
37.5%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Verify blade specifications match exactly with 8456.12 wafer slicing saws; provide end-use statement confirming semiconductor application; ensure diamond content declaration for accurate valuation