Wafer Slicing Diamond Saw Blade from Canada
Precision diamond-impregnated saw blade designed for wafer slicing saws used to cut monocrystalline semiconductor boules into thin wafers. Specifically engineered for machine tools in subheading 8456.12, suitable solely for printed circuit and semiconductor manufacturing equipment. Its ultra-fine grit and tension control ensure damage-free wafer separation critical for subsequent fabrication processes.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Verify blade specifications match exactly with 8456.12 wafer slicing saws; provide end-use statement confirming semiconductor application; ensure diamond content declaration for accurate valuation