Wafer Polishing Head Assembly from Germany
Multi-head polishing assembly for wafer polishers that achieve mirror finish on semiconductor wafers for device fabrication. Precision kinematic mounts ensure uniform pressure distribution across 300mm wafers in 8456.30 machines dedicated to printed circuit manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify pressure uniformity specifications; document compatibility with CMP processes; verify cleanroom compatibility certifications