Wafer Polishing Head Assembly from Germany
Multi-head polishing assembly for wafer polishers that achieve mirror finish on semiconductor wafers for device fabrication. Precision kinematic mounts ensure uniform pressure distribution across 300mm wafers in 8456.30 machines dedicated to printed circuit manufacturing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Certify pressure uniformity specifications; document compatibility with CMP processes; verify cleanroom compatibility certifications