Wafer Lapping Plate from Mexico
Cast iron or copper lapping plate used in wafer grinders/lappers to achieve flatness tolerances under 1 micron for semiconductor wafers prior to fabrication. Surface-engineered for 8456.30 machine tools dedicated to printed circuit manufacturing processes. Maintains parallelism critical for subsequent photolithography alignment.
Duty Rate — Mexico → United States
10%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Document surface flatness specifications proving semiconductor use; ensure plate material certification; check for REACH compliance on plating materials