Wafer Lapping Plate from Germany
Cast iron or copper lapping plate used in wafer grinders/lappers to achieve flatness tolerances under 1 micron for semiconductor wafers prior to fabrication. Surface-engineered for 8456.30 machine tools dedicated to printed circuit manufacturing processes. Maintains parallelism critical for subsequent photolithography alignment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Document surface flatness specifications proving semiconductor use; ensure plate material certification; check for REACH compliance on plating materials