Wafer Lapping Plate from Germany
Cast iron or copper lapping plate used in wafer grinders/lappers to achieve flatness tolerances under 1 micron for semiconductor wafers prior to fabrication. Surface-engineered for 8456.30 machine tools dedicated to printed circuit manufacturing processes. Maintains parallelism critical for subsequent photolithography alignment.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Document surface flatness specifications proving semiconductor use; ensure plate material certification; check for REACH compliance on plating materials