Wafer Grinder Workholding Chuck from Japan
Vacuum/porous ceramic chuck for securing semiconductor wafers during grinding operations in 8456.30 precision machines. Maintains wafer flatness during thickness reduction for printed circuit fabrication processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify porosity and vacuum specifications; provide flatness retention test data; certify ceramic material purity