Wafer Grinder Workholding Chuck from Japan
Vacuum/porous ceramic chuck for securing semiconductor wafers during grinding operations in 8456.30 precision machines. Maintains wafer flatness during thickness reduction for printed circuit fabrication processes.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify porosity and vacuum specifications; provide flatness retention test data; certify ceramic material purity