Wafer Grinder Workholding Chuck from Germany
Vacuum/porous ceramic chuck for securing semiconductor wafers during grinding operations in 8456.30 precision machines. Maintains wafer flatness during thickness reduction for printed circuit fabrication processes.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify porosity and vacuum specifications; provide flatness retention test data; certify ceramic material purity