Wafer Grinder Workholding Chuck from Canada
Vacuum/porous ceramic chuck for securing semiconductor wafers during grinding operations in 8456.30 precision machines. Maintains wafer flatness during thickness reduction for printed circuit fabrication processes.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify porosity and vacuum specifications; provide flatness retention test data; certify ceramic material purity