Wafer Grinder Workholding Chuck from Canada
Vacuum/porous ceramic chuck for securing semiconductor wafers during grinding operations in 8456.30 precision machines. Maintains wafer flatness during thickness reduction for printed circuit fabrication processes.
Duty Rate — Canada → United States
10%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Specify porosity and vacuum specifications; provide flatness retention test data; certify ceramic material purity