Wafer Crystal Grinder Diamond Wheel from Mexico
Resin- or metal-bonded diamond grinding wheel for crystal grinders that shape semiconductor boules to precise diameters before wafer slicing (HTS 8465). Achieves flatness specifications critical for wafer uniformity. Under 8466.92.50 as special attachment for heading 8465 machines.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit grinding wheel specs showing semiconductor boule diameter tolerances (±0.1mm)
• Include photos/diagrams of installation on specific 8465 grinder models