Wafer Crystal Grinder Diamond Wheel from Germany
Resin- or metal-bonded diamond grinding wheel for crystal grinders that shape semiconductor boules to precise diameters before wafer slicing (HTS 8465). Achieves flatness specifications critical for wafer uniformity. Under 8466.92.50 as special attachment for heading 8465 machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Submit grinding wheel specs showing semiconductor boule diameter tolerances (±0.1mm)
• Include photos/diagrams of installation on specific 8465 grinder models