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8466.92.50/Wafer Crystal Grinder Diamond Wheel/Canada

Wafer Crystal Grinder Diamond Wheel from Canada

Resin- or metal-bonded diamond grinding wheel for crystal grinders that shape semiconductor boules to precise diameters before wafer slicing (HTS 8465). Achieves flatness specifications critical for wafer uniformity. Under 8466.92.50 as special attachment for heading 8465 machines.

Duty Rate — Canada → United States

14.7%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Submit grinding wheel specs showing semiconductor boule diameter tolerances (±0.1mm)

• Include photos/diagrams of installation on specific 8465 grinder models