Semiconductor Wafer Slicing Diamond Saw Blade from Mexico
Ultra-thin diamond-impregnated saw blade for inner-diameter wafer slicing saws that cut monocrystalline boules into semiconductor wafers (8465 equipment). Features coolant channels and precise kerf for minimal material loss. Classified in 8466.92.50 as a tool holder attachment for heading 8465 machines.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include blade specifications showing wafer thickness tolerances (<100μm) for proper classification
• Require end-user affidavits confirming use in semiconductor fab, not gemstone or general cutting