Semiconductor Wafer Slicing Diamond Saw Blade from Japan
Ultra-thin diamond-impregnated saw blade for inner-diameter wafer slicing saws that cut monocrystalline boules into semiconductor wafers (8465 equipment). Features coolant channels and precise kerf for minimal material loss. Classified in 8466.92.50 as a tool holder attachment for heading 8465 machines.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Include blade specifications showing wafer thickness tolerances (<100μm) for proper classification
• Require end-user affidavits confirming use in semiconductor fab, not gemstone or general cutting