Semiconductor Wafer Slicing Diamond Saw Blade from China
Ultra-thin diamond-impregnated saw blade for inner-diameter wafer slicing saws that cut monocrystalline boules into semiconductor wafers (8465 equipment). Features coolant channels and precise kerf for minimal material loss. Classified in 8466.92.50 as a tool holder attachment for heading 8465 machines.
Duty Rate — China → United States
39.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Include blade specifications showing wafer thickness tolerances (<100μm) for proper classification
• Require end-user affidavits confirming use in semiconductor fab, not gemstone or general cutting