Double-Sided Wafer Lapping Carrier from Japan
Precision carrier plate holding multiple wafers between upper/lower lapping plates in double-sided lappers (8465). Ensures parallel thickness reduction. Classified 8466.92.50 work holder.
Duty Rate — Japan → United States
14.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Carrier hole pattern specs matching standard wafer sizes
• Material certification for lapping slurry resistance