Double-Sided Wafer Lapping Carrier from Japan
Precision carrier plate holding multiple wafers between upper/lower lapping plates in double-sided lappers (8465). Ensures parallel thickness reduction. Classified 8466.92.50 work holder.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Carrier hole pattern specs matching standard wafer sizes
• Material certification for lapping slurry resistance