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8466.92.50.90/Wafer Slicing Coolant Nozzle Assembly/Japan

Wafer Slicing Coolant Nozzle Assembly from Japan

Precision coolant nozzle manifold for wafer slicing saws (8465), delivers deionized water to diamond wire cut zone preventing thermal damage to silicon wafers. Adjustable flow for 200-450mm wafers. 8466.92.5050 accessory.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify DI water purity requirements and nozzle orifice sizes in specs

• Prove integration with specific wire saw models for heading 8465 confirmation