Wafer Slicing Coolant Nozzle Assembly from Germany
Precision coolant nozzle manifold for wafer slicing saws (8465), delivers deionized water to diamond wire cut zone preventing thermal damage to silicon wafers. Adjustable flow for 200-450mm wafers. 8466.92.5050 accessory.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify DI water purity requirements and nozzle orifice sizes in specs
• Prove integration with specific wire saw models for heading 8465 confirmation