Wafer Slicing Coolant Nozzle Assembly from China
Precision coolant nozzle manifold for wafer slicing saws (8465), delivers deionized water to diamond wire cut zone preventing thermal damage to silicon wafers. Adjustable flow for 200-450mm wafers. 8466.92.5050 accessory.
Duty Rate — China → United States
39.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
Import Tips
• Specify DI water purity requirements and nozzle orifice sizes in specs
• Prove integration with specific wire saw models for heading 8465 confirmation