Wafer Polishing Head Assembly from Mexico
Kinematic polishing head with retaining ring for wafer polishers classified in 8465, applies controlled pressure and slurry distribution for mirror-finish semiconductor wafer surfaces. Essential for final preparation before device fabrication. 8466.92.5050 part for heading 8465 machines.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
Import Tips
• Provide pressure/platen rotation specs and CMP pad compatibility details
• Reference statistical note (b)(ii)(C) for wafer grinder/polisher classification support