Wafer Polishing Head Assembly from Germany
Kinematic polishing head with retaining ring for wafer polishers classified in 8465, applies controlled pressure and slurry distribution for mirror-finish semiconductor wafer surfaces. Essential for final preparation before device fabrication. 8466.92.5050 part for heading 8465 machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide pressure/platen rotation specs and CMP pad compatibility details
• Reference statistical note (b)(ii)(C) for wafer grinder/polisher classification support