Wafer Polishing Head Assembly from China
Kinematic polishing head with retaining ring for wafer polishers classified in 8465, applies controlled pressure and slurry distribution for mirror-finish semiconductor wafer surfaces. Essential for final preparation before device fabrication. 8466.92.5050 part for heading 8465 machines.
Duty Rate — China → United States
42.2%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Provide pressure/platen rotation specs and CMP pad compatibility details
• Reference statistical note (b)(ii)(C) for wafer grinder/polisher classification support