Wafer Lapper Slurry Distribution Ring from Japan
Perforated slurry distribution ring for wafer lappers (8465), ensures uniform abrasive delivery across platen surface for consistent material removal rates. Semiconductor-grade polymer construction. 8466.92.5050 part.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify slurry particle size compatibility (silica 0.5-2µm) and flow rates
• Cleanroom outgassing test data prevents plastic classification