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8466.92.50.90/Wafer Lapper Slurry Distribution Ring/Japan

Wafer Lapper Slurry Distribution Ring from Japan

Perforated slurry distribution ring for wafer lappers (8465), ensures uniform abrasive delivery across platen surface for consistent material removal rates. Semiconductor-grade polymer construction. 8466.92.5050 part.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Specify slurry particle size compatibility (silica 0.5-2µm) and flow rates

• Cleanroom outgassing test data prevents plastic classification

Wafer Lapper Slurry Distribution Ring from Japan — Import Duty Rate | HTS 8466.92.50.90