Wafer Lapper Slurry Distribution Ring from Germany
Perforated slurry distribution ring for wafer lappers (8465), ensures uniform abrasive delivery across platen surface for consistent material removal rates. Semiconductor-grade polymer construction. 8466.92.5050 part.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Specify slurry particle size compatibility (silica 0.5-2µm) and flow rates
• Cleanroom outgassing test data prevents plastic classification