Wafer Lapper Slurry Distribution Ring from Canada
Perforated slurry distribution ring for wafer lappers (8465), ensures uniform abrasive delivery across platen surface for consistent material removal rates. Semiconductor-grade polymer construction. 8466.92.5050 part.
Duty Rate — Canada → United States
14.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify slurry particle size compatibility (silica 0.5-2µm) and flow rates
• Cleanroom outgassing test data prevents plastic classification