Wafer Grinder Spindle Bearing Kit from Mexico
Ultra-precision air bearing kit for wafer grinder spindles (8465), provides sub-micron runout for flatness-critical semiconductor wafer processing. Cleanroom-compatible ceramic hybrid bearings. 8466.92.5050.
Duty Rate — Mexico → United States
14.7%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include runout specs (<0.1µm), air pressure requirements, and wafer flatness correlation data
• ABEC/ISO precision class certification (P0 or higher) supports classification