Wafer Grinder Spindle Bearing Kit from Japan
Ultra-precision air bearing kit for wafer grinder spindles (8465), provides sub-micron runout for flatness-critical semiconductor wafer processing. Cleanroom-compatible ceramic hybrid bearings. 8466.92.5050.
Duty Rate — Japan → United States
14.7%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include runout specs (<0.1µm), air pressure requirements, and wafer flatness correlation data
• ABEC/ISO precision class certification (P0 or higher) supports classification