8466.92.50.90/Wafer Grinder Spindle Bearing Kit/Japan

Wafer Grinder Spindle Bearing Kit from Japan

Ultra-precision air bearing kit for wafer grinder spindles (8465), provides sub-micron runout for flatness-critical semiconductor wafer processing. Cleanroom-compatible ceramic hybrid bearings. 8466.92.5050.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Include runout specs (<0.1µm), air pressure requirements, and wafer flatness correlation data

• ABEC/ISO precision class certification (P0 or higher) supports classification