Wafer Grinder Spindle Bearing Kit from Germany
Ultra-precision air bearing kit for wafer grinder spindles (8465), provides sub-micron runout for flatness-critical semiconductor wafer processing. Cleanroom-compatible ceramic hybrid bearings. 8466.92.5050.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include runout specs (<0.1µm), air pressure requirements, and wafer flatness correlation data
• ABEC/ISO precision class certification (P0 or higher) supports classification