Wafer Grinder Spindle Bearing Kit from Germany
Ultra-precision air bearing kit for wafer grinder spindles (8465), provides sub-micron runout for flatness-critical semiconductor wafer processing. Cleanroom-compatible ceramic hybrid bearings. 8466.92.5050.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Include runout specs (<0.1µm), air pressure requirements, and wafer flatness correlation data
• ABEC/ISO precision class certification (P0 or higher) supports classification