Semiconductor Wafer Lapping Plate from Japan
Cast iron lapping plate for wafer grinders/lappers of heading 8465, provides flat reference surface for bringing silicon wafers to critical thickness tolerances before polishing. Designed for loose abrasive slurry processes in semiconductor fabrication prep. Principal part under 8466.92.5050.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Specify flatness tolerance (e.g
• <1 micron) and slurry compatibility in technical data sheets
• Include process flow documentation showing pre-polish lapping stage in wafer manufacturing