Wafer Chuck Vacuum Plate for Crystal Grinders from Japan
Precision vacuum chuck plate secures semiconductor crystal boules during grinding to exact diameters and flats indicating conductivity. It is a part for 8464 grinding machines, thus under HTS 8466.91.50.00 per statistical notes on wafer prep equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Import Tips
• Document vacuum pressure specs and flatness tolerances matching statistical note (b) crystal grinders
• Use HTS advisory rulings for borderline cases to confirm principal use with 8464 equipment