Wafer Slicing Diamond Saw from Japan
High-precision inner-diameter saw with diamond blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. HTS 8466.30.60 covers it as a special attachment dedicated to semiconductor wafer manufacturing equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify blade specifications for semiconductor materials only to qualify for this heading
• Avoid pitfall of general saw classification by providing wafer thickness tolerance data
• Document integration with crystal puller systems for proper special attachment status