Wafer Slicing Diamond Saw from China
High-precision inner-diameter saw with diamond blade for slicing ultra-thin wafers from monocrystalline semiconductor boules. HTS 8466.30.60 covers it as a special attachment dedicated to semiconductor wafer manufacturing equipment.
Duty Rate — China → United States
40.4%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Certify blade specifications for semiconductor materials only to qualify for this heading
• Avoid pitfall of general saw classification by providing wafer thickness tolerance data
• Document integration with crystal puller systems for proper special attachment status