</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8466.30.60/Wafer Edge Profiling Attachment/Japan

Wafer Edge Profiling Attachment from Japan

Specialized tool that profiles wafer edges to prevent chipping and contamination during handling in semiconductor fabs. HTS 8466.30.60 as dividing head/other special attachment for wafer processing machines.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Demonstrate principal use with statistical note equipment via technical literature

• Package with compatible wafer grinder to establish attachment relationship