Wafer Edge Profiling Attachment from Germany
Specialized tool that profiles wafer edges to prevent chipping and contamination during handling in semiconductor fabs. HTS 8466.30.60 as dividing head/other special attachment for wafer processing machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Demonstrate principal use with statistical note equipment via technical literature
• Package with compatible wafer grinder to establish attachment relationship