Wafer Edge Profiling Attachment from Germany
Specialized tool that profiles wafer edges to prevent chipping and contamination during handling in semiconductor fabs. HTS 8466.30.60 as dividing head/other special attachment for wafer processing machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Demonstrate principal use with statistical note equipment via technical literature
• Package with compatible wafer grinder to establish attachment relationship