8466.30.60/Wafer Edge Profiling Attachment/Canada

Wafer Edge Profiling Attachment from Canada

Specialized tool that profiles wafer edges to prevent chipping and contamination during handling in semiconductor fabs. HTS 8466.30.60 as dividing head/other special attachment for wafer processing machines.

Duty Rate — Canada → United States

12.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter

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Import Tips

• Demonstrate principal use with statistical note equipment via technical literature

• Package with compatible wafer grinder to establish attachment relationship