Single-Side Wafer Polisher from Mexico
Precision polisher that creates mirror-finish on one side of semiconductor wafers for device fabrication processes. Classified as other special attachment under HTS 8466.30.60 for use with wafer grinding machines.
Duty Rate — Mexico → United States
12.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Include surface roughness specifications (angstrom-level) in import documentation
• Classify as attachment, not complete machine, by showing host machine dependency