8466.30.60/Single-Side Wafer Polisher/Japan

Single-Side Wafer Polisher from Japan

Precision polisher that creates mirror-finish on one side of semiconductor wafers for device fabrication processes. Classified as other special attachment under HTS 8466.30.60 for use with wafer grinding machines.

Duty Rate — Japan → United States

12.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Include surface roughness specifications (angstrom-level) in import documentation

• Classify as attachment, not complete machine, by showing host machine dependency

Single-Side Wafer Polisher from Japan — Import Duty Rate | HTS 8466.30.60