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8466.30.60/Single-Side Wafer Polisher/Japan

Single-Side Wafer Polisher from Japan

Precision polisher that creates mirror-finish on one side of semiconductor wafers for device fabrication processes. Classified as other special attachment under HTS 8466.30.60 for use with wafer grinding machines.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Include surface roughness specifications (angstrom-level) in import documentation

• Classify as attachment, not complete machine, by showing host machine dependency

Single-Side Wafer Polisher from Japan — Import Duty Rate | HTS 8466.30.60