Single-Side Wafer Polisher from Germany
Precision polisher that creates mirror-finish on one side of semiconductor wafers for device fabrication processes. Classified as other special attachment under HTS 8466.30.60 for use with wafer grinding machines.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.97, articles the product of a member state of the European Union, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 10 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Include surface roughness specifications (angstrom-level) in import documentation
• Classify as attachment, not complete machine, by showing host machine dependency