Semiconductor Wafer Lapper from Germany
Machine that laps both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness for subsequent processing. As a special attachment for wafer prep machines, it falls under HTS 8466.30.60.
Duty Rate — Germany → United States
12.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Provide metrology specs showing tolerances beyond general industrial lapping capabilities
• Ensure bill of materials excludes non-semiconductor applications