Semiconductor Wafer Lapper from Germany
Machine that laps both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness for subsequent processing. As a special attachment for wafer prep machines, it falls under HTS 8466.30.60.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Provide metrology specs showing tolerances beyond general industrial lapping capabilities
• Ensure bill of materials excludes non-semiconductor applications