Semiconductor Wafer Lapper from Canada
Machine that laps both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness for subsequent processing. As a special attachment for wafer prep machines, it falls under HTS 8466.30.60.
Duty Rate — Canada → United States
12.9%
Rate breakdown
9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
Import Tips
• Provide metrology specs showing tolerances beyond general industrial lapping capabilities
• Ensure bill of materials excludes non-semiconductor applications