Semiconductor Wafer Lapper from Canada
Machine that laps both sides of semiconductor wafers simultaneously to achieve precise thickness uniformity and flatness for subsequent processing. As a special attachment for wafer prep machines, it falls under HTS 8466.30.60.
Duty Rate — Canada → United States
12.9%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Provide metrology specs showing tolerances beyond general industrial lapping capabilities
• Ensure bill of materials excludes non-semiconductor applications