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8466.30.60/Gallium Arsenide Wafer Slicer/Mexico

Gallium Arsenide Wafer Slicer from Mexico

Specialized slicing machine optimized for brittle GaAs compound semiconductor boules, featuring lower feed rates and coolant systems. Classified under HTS 8466.30.60 for compound semiconductor processing.

Duty Rate — Mexico → United States

12.9%

Rate breakdown

9903.05.5510%Section 301 (forced labor) — additional 10% ad valorem on products of Mexico
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Import Tips

• Specify material compatibility (GaAs, InP) beyond silicon-only equipment

• Include vibration isolation specs critical for compound semiconductors

• Document lower duty rates vs general diamond saws for these applications

Gallium Arsenide Wafer Slicer from Mexico — Import Duty Rate | HTS 8466.30.60