Gallium Arsenide Wafer Slicer from Japan
Specialized slicing machine optimized for brittle GaAs compound semiconductor boules, featuring lower feed rates and coolant systems. Classified under HTS 8466.30.60 for compound semiconductor processing.
Duty Rate — Japan → United States
12.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Specify material compatibility (GaAs, InP) beyond silicon-only equipment
• Include vibration isolation specs critical for compound semiconductors
• Document lower duty rates vs general diamond saws for these applications