</>Build with Tariff Intelligence|Programmatic access to tariff calculations and HS code classification.Explore Developer Resources →
8466.30.60/Gallium Arsenide Wafer Slicer/Japan

Gallium Arsenide Wafer Slicer from Japan

Specialized slicing machine optimized for brittle GaAs compound semiconductor boules, featuring lower feed rates and coolant systems. Classified under HTS 8466.30.60 for compound semiconductor processing.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
Calculate with your customs valueVerify classification with AI

Import Tips

• Specify material compatibility (GaAs, InP) beyond silicon-only equipment

• Include vibration isolation specs critical for compound semiconductors

• Document lower duty rates vs general diamond saws for these applications

Gallium Arsenide Wafer Slicer from Japan — Import Duty Rate | HTS 8466.30.60