Gallium Arsenide Wafer Slicer from Germany
Specialized slicing machine optimized for brittle GaAs compound semiconductor boules, featuring lower feed rates and coolant systems. Classified under HTS 8466.30.60 for compound semiconductor processing.
Duty Rate — Germany → United States
10%
Rate breakdown
9903.05.3910%Section 301 (forced labor) — European Union member state (col1 rate < 10 percent): MFN < 10% → total duty capped at 10%
Import Tips
• Specify material compatibility (GaAs, InP) beyond silicon-only equipment
• Include vibration isolation specs critical for compound semiconductors
• Document lower duty rates vs general diamond saws for these applications