Gallium Arsenide Wafer Slicer from China
Specialized slicing machine optimized for brittle GaAs compound semiconductor boules, featuring lower feed rates and coolant systems. Classified under HTS 8466.30.60 for compound semiconductor processing.
Duty Rate — China → United States
40.4%
Rate breakdown
9903.88.0125%Except as provided in headings 9903.88.05, 9903.88.06, 9903.88.07, 9903.88.08, 9903.88.10, 9903.88.11, 9903.88.14, 9903.88.19, 9903.88.50, 9903.88.52, 9903.88.58, 9903.88.60, 9903.88.62, 9903.88.66, 9903.88.67, 9903.88.68, or 9903.88.69, articles the product of China, as provided for in U.S. note 20(a) to this subchapter and as provided for in the subheadings enumerated in U.S. note 20(b) [to this subchapter]
9903.05.3112.5%Section 301 (forced labor) — additional 12.5% ad valorem on products of China
Import Tips
• Specify material compatibility (GaAs, InP) beyond silicon-only equipment
• Include vibration isolation specs critical for compound semiconductors
• Document lower duty rates vs general diamond saws for these applications