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8466.30.60/Double-Side Semiconductor Wafer Grinder/Japan

Double-Side Semiconductor Wafer Grinder from Japan

Simultaneous double-side grinder that processes both wafer faces concurrently for optimal flatness in semiconductor device fabrication. HTS 8466.30.60 as special attachment for wafer preparation equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%
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Import Tips

• Total thickness variation (TTV) specs must demonstrate semiconductor tolerances

• Classify as attachment when sold with compatible grinding spindles

Double-Side Semiconductor Wafer Grinder from Japan — Import Duty Rate | HTS 8466.30.60