Double-Side Semiconductor Wafer Grinder from Japan
Simultaneous double-side grinder that processes both wafer faces concurrently for optimal flatness in semiconductor device fabrication. HTS 8466.30.60 as special attachment for wafer preparation equipment.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Total thickness variation (TTV) specs must demonstrate semiconductor tolerances
• Classify as attachment when sold with compatible grinding spindles