Double-Side Semiconductor Wafer Grinder from Japan
Simultaneous double-side grinder that processes both wafer faces concurrently for optimal flatness in semiconductor device fabrication. HTS 8466.30.60 as special attachment for wafer preparation equipment.
Duty Rate — Japan → United States
12.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Total thickness variation (TTV) specs must demonstrate semiconductor tolerances
• Classify as attachment when sold with compatible grinding spindles