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8466.30.60/Double-Side Semiconductor Wafer Grinder/Canada

Double-Side Semiconductor Wafer Grinder from Canada

Simultaneous double-side grinder that processes both wafer faces concurrently for optimal flatness in semiconductor device fabrication. HTS 8466.30.60 as special attachment for wafer preparation equipment.

Duty Rate — Canada → United States

12.9%

Rate breakdown

9903.05.2910%Section 301 (forced labor) — additional 10% ad valorem on products of Canada
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Import Tips

• Total thickness variation (TTV) specs must demonstrate semiconductor tolerances

• Classify as attachment when sold with compatible grinding spindles