Double-Side Semiconductor Wafer Grinder from Canada
Simultaneous double-side grinder that processes both wafer faces concurrently for optimal flatness in semiconductor device fabrication. HTS 8466.30.60 as special attachment for wafer preparation equipment.
Duty Rate — Canada → United States
12.9%
Rate breakdown
9903.05.2910%Except for products described in headings 9903.05.85–9903.05.93, articles the product of Canada, as provided for in U.S. note 52 to this subchapter
Import Tips
• Total thickness variation (TTV) specs must demonstrate semiconductor tolerances
• Classify as attachment when sold with compatible grinding spindles