Crystal Boule Grinder from Japan
Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity type. Classified in HTS 8466.30.60 as a special attachment for wafer preparation machines under headings 8456-8465.
Duty Rate — Japan → United States
12.5%
Rate breakdown
9903.05.4912.5%Except for products described in headings 9903.05.85–9903.05.92, articles the product of Japan, with an ad valorem (or ad valorem equivalent) rate of duty under column 1 less than 12.5 percent, as provided for in U.S. note 52 to this subchapter
Import Tips
• Submit engineering drawings showing compatibility only with semiconductor processing machines
• Maintain records of semiconductor fab end-users for audit compliance