Crystal Boule Grinder from Japan

Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity type. Classified in HTS 8466.30.60 as a special attachment for wafer preparation machines under headings 8456-8465.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Submit engineering drawings showing compatibility only with semiconductor processing machines

• Maintain records of semiconductor fab end-users for audit compliance