Crystal Boule Grinder from Japan
Precision grinder that shapes semiconductor crystal boules to exact diameters and grinds orientation flats indicating conductivity type. Classified in HTS 8466.30.60 as a special attachment for wafer preparation machines under headings 8456-8465.
Duty Rate — Japan → United States
12.9%
Rate breakdown
9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
Import Tips
• Submit engineering drawings showing compatibility only with semiconductor processing machines
• Maintain records of semiconductor fab end-users for audit compliance