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8466.30.60.85/Wafer Lapping Machine Special Attachment/Mexico

Wafer Lapping Machine Special Attachment from Mexico

Precision attachment for wafer lappers ensuring flatness tolerances during semiconductor wafer preparation for fabrication. Fits HTS 8466.30.60.85 as other special attachments for statistical note (b)(ii)(C) equipment.

Duty Rate — Mexico → United States

12.9%

Rate breakdown

9903.03.0110%Except for products described in headings 9903.03.02–9903.03.11, articles the product of any country, as provided for in subdivision (aa) of U.S. note 2 to this subchapter
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Import Tips

• Certify surface flatness specs (e.g

• <1 micron) to match statistical note criteria

• Use HTSUS advisory rulings for complex lapping/polishing combos

Wafer Lapping Machine Special Attachment from Mexico — Import Duty Rate | HTS 8466.30.60.85