Wafer Lapping Machine Special Attachment from Mexico
Precision attachment for wafer lappers ensuring flatness tolerances during semiconductor wafer preparation for fabrication. Fits HTS 8466.30.60.85 as other special attachments for statistical note (b)(ii)(C) equipment.
Duty Rate — Mexico → United States
12.9%
Rate breakdown
9903.05.5510%Except for products described in headings 9903.05.85–9903.05.92 and 9903.05.94, articles the product of Mexico, as provided for in U.S. note 52 to this subchapter
Import Tips
• Certify surface flatness specs (e.g
• <1 micron) to match statistical note criteria
• Use HTSUS advisory rulings for complex lapping/polishing combos