8466.30.60.85/Wafer Lapping Machine Special Attachment/Japan

Wafer Lapping Machine Special Attachment from Japan

Precision attachment for wafer lappers ensuring flatness tolerances during semiconductor wafer preparation for fabrication. Fits HTS 8466.30.60.85 as other special attachments for statistical note (b)(ii)(C) equipment.

Duty Rate — Japan → United States

12.5%

Rate breakdown

9903.05.4912.5%Section 301 (forced labor) — Japan (col1 rate < 12.5 percent): MFN < 12.5% → total duty capped at 12.5%

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Import Tips

• Certify surface flatness specs (e.g

• <1 micron) to match statistical note criteria

• Use HTSUS advisory rulings for complex lapping/polishing combos